The IEC is in the process of endorsing IPC-A as the globally preferred international acceptance standard for electronics assembly. AE training for through hole and surface mount solder joint acceptance standards inspection from IPC, a trade association for the electronics industry. IPC-AG is the latest revision of the most widely used electronics assembly standard in the world. IPC AG is now available from.
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The E revision contains new or updated illustrations, bringing the total to more than In addition, the standard has been revamped for ease of use and clarity.
IPC J-STDE provides material and process requirements for producing soldered electrical and electronic assemblies, aiding those who set up manufacturing processes. IPC-A is invaluable for all inspectors, operators and trainers. See More See Less. Translations of the revised standard in multiple languages will be released in the coming months.
IPC-A-610E: Acceptability of Electronic Assemblies
The document synchronizes to the 60e expressed in other industry consensus documents and is used with the material and process standard IPC J-STD IPC maintains additional offices in Taos, N.
Designers and manufacturers will appreciate criteria for package-on-package technologies, often used to boost solid-state memory capacity, and for board-in-board connections, where daughter boards can be mounted perpendicular to the assembly using a through-the-board method.
The photos and drawings that show good and bad connections, considered one of the most important features of IPC-A, have also been upgraded. Topics include flex attachment, board in board, part on part, lead free, component orientation and soldering criteria for through-hole, SMT new termination styles and discrete wiring assemblies, mechanical assembly, cleaning, marking, coating, and laminate requirements.
IPC’s most widely-used standard, which provides visual acceptance criteria for post assembly mechanical and soldering assembly requirements, now addresses additional technologies, including flexible circuits, board in board, package on package, depanelization and additional SMT terminations.
This revision has been critically reviewed for clarity and accuracy. Please allow 2 business days for us to review and process your order. Sections have been reorganized so data and images are easier to find and to make it easier to use. The many changes that have occurred in array packaging since the standard’s last revision are also addressed in the E revision, as are changes to hot tear and fillet lifting.
A must for all quality assurance and assembly departments, IPC-AE illustrates industry-accepted workmanship criteria for electronics assemblies through full-color photographs and illustrations.
IPC-AE IPC Certification
Acceptability of Electronic Assemblies. There are new sections on depanelization, board in board, package on package, and flex attachment, which Jack Crawford, IPC director of certification, calls “high interest topics. IPC-A is the most widely used electronics assembly standard in the world. For more information 6610e IPCE, visit www. Zenaida Valianu, ippc and development specialist at Celestica agrees, “The document is more intuitive and manageable than before, allowing users to navigate more easily and locate information promptly.